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ISOSD61L датащи(PDF) 14 Page - STMicroelectronics |
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ISOSD61L датащи(HTML) 14 Page - STMicroelectronics |
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14 / 23 page ![]() 5.3 Application design tips In Figure 6 below a typical application schematics is shown: Figure 6. Typical application schematics VDD VDDIS O VIN- VIN+ N L VDDISO VDD M 330n 10R 1 2 3 4 5 6 7 8 9 10 11 12 13 15 14 16 10u MCKIN- (LVDS only) 1 10u MDAT- (LVDS only) 1 330n 100n 100n 10R VDD 1 2 Shunt MCKIN+/MCKIN 1 VDDISO 1 2 MDAT+/MDAT 1 Large use of capacitors on both VDDiso and VDD supply pins for decoupling is strongly recommended. Though the device can withstand high transients across the isolation barrier, the application designer must take care of board coupling between the analog front-end and the digital back-end domains. They must also take design actions in order to avoid any loss of clearance and creepage distances. Failure to ensure these can lead to severe permanent damage. The analog input tracks should be kept symmetrical and equalized in impedance, to minimize additional offset. The use of ground planes for noise reduction is recommended. For LVDS digital interfacing, the use of termination resistors (typically 100 ohm) is recommended. ISOSD61 Application design tips DS13605 - Rev 8 page 14/23 |
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