2.2

Reflow profile

Figure 31. ST ECOPACK recommended soldering reflow profile for PCB mounting

250

0

50

100

150

200

240

210

180

150

120

90

60

30

300

270

-6 °C/s

240-245 °C

2 - 3 °C/s

Temperature (°C)

-2 °C/s

-3 °C/s

Time (s)

0.9 °C/s

60 sec

(90 max)

Note:

Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile

corresponds to the latest IPC/JEDEC J-STD-020.

SM30TxxAY, SM30TxxCAY

Reflow profile

DS8599 - Rev 12

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