ACTS08MS

FN3994 Rev 0.00

Page 5 of 8

April 1995

Propagation Delay Timing Diagram and Load Circuit

Intersil - Space Products MS Screening

Wafer Lot Acceptance (All Lots) Method 5007 (Includes SEM)

Radiation Verification (Each Wafer) Method 1019,

4 Samples/Wafer, 0 Rejects

100% Nondestructive Bond Pull Method 2023

100% Internal Visual Inspection Method 2010

100% Temperature Cycling Method 1010 Condition C

(-65o to +150oC)

100% Constant Acceleration

100% PIND Testing

100% External Visual Inspection

100% Serialization

100% Initial Electrical Test

100% Static Burn-In 1 Method 1015, 24 Hours at +125oC Min

100% Interim Electrical Test 1 (Note 1)

100% Static Burn-In 2 Method 1015, 24 Hours at +125oC Min

100% Interim Electrical Test 2 (Note 1)

100% Dynamic Burn-In Method 1015, 240 Hours at +125oC

or 180 Hours at +135oC

100% Interim Electrical Test 3 (Note 1)

100% Final Electrical Test

100% Fine and Gross Seal Method 1014

100% Radiographics Method 2012 (2 Views)

100% External Visual Method 2009

Group A (All Tests) Method 5005 (Class S)

Group B (Optional) Method 5005 (Class S) (Note 2)

Group D (Optional) Method 5005 (Class S) (Note 2)

CSI and/or GSI (Optional) (Note 2)

Data Package Generation (Note 3)

NOTES:

1. Failures from interim electrical tests 1 and 2 are combined for determining PDA (PDA = 5% for subgroups 1, 7, 9 and delta failures com-

bined, PDA = 3% for subgroup 7 failures). Interim electrical tests 3 PDA (PDA = 5% for subgroups 1, 7, 9 and delta failures combined,

PDA = 3% for subgroup 7 failures).

2. These steps are optional, and should be listed on the purchase order if required.

3. Data Package Contents:

Cover Sheet (P.O. Number, Customer Number, Lot Date Code, Intersil Number, Lot Number, Quantity).

Certificate of Conformance (as found on shipper).

Lot Serial Number Sheet (Good Unit(s) Serial Number and Lot Number).

Variables Data (All Read, Record, and delta operations).

Group A Attributes Data Summary.

Wafer Lot Acceptance Report (Method 5007) to include reproductions of SEM photos. NOTE: SEM photos to include percent of step coverage.

X-Ray Report and Film, including penetrometer measurements.

GAMMA Radiation Report with initial shipment of devices from the same wafer lot; containing a Cover Page, Disposition, RAD Dose,

Lot Number, Test Package, Spec Number(s), Test Equipment, etc. Irradiation Read and Record data will be on file at Intersil.

VS

INPUT

OUTPUT

VIH

VSS

VOH

VOL

TPLH

TPHL

VS

AC VOLTAGE LEVELS

PARAMETER

ACTS

UNITS

VCC

4.50

V

VIH

3.00

V

VS

1.30

V

VIL

0

V

GND

0

V

DUT

TEST

CL

RL

POINT

50pF

500

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