DC–28 GHz GaAs MMIC Distributed Amplifier

18

4 Chip Outline Drawing, Die Packaging, Bond Pad, and Assembly

Information

4.1 Chip Outline Drawing

The following illustration shows the chip outline of the MMA040AA device. Dimensions are in μm

and are relative to the zero datum locations shown in the drawing. The minimum bond pad size is

100 μm × 100 μm. Both the bond pad surface and the backside metal are 3 μm gold. The die

thickness is 100 μm. The backside is the DC/RF ground. The airbridge keep out region is in

crosshatch, and the unlabeled pads should not be bonded.

Figure 19 Outline Drawing

4.2 Die Packaging Information

The following table shows the chip outline of the MMA040AA device. For additional packaging

information, contact your Microsemi sales representative.

Table 3 Die Packaging Information

Standard Format

Option Format

Waffle Pack

Gel Pack

50-100 pieces per pack

50 pieces per pack