UCS3205

DS20006433A-page 24

 2020 Microchip Technology Inc.

RECOMMENDED LAND PATTERN

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

1.

2.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

E

X1

C1

C3

C2

C4

X2

Y2

Y1

ØV

G1

G2

Dimension Limits

Units

C2

Optional Center Pad Width

Contact Pad Spacing

Optional Center Pad Length

Contact Pitch

Y2

X2

1.35

0.80

MILLIMETERS

0.50 BSC

MIN

E

MAX

3.10

Contact Pad Length (X19)

Contact Pad Width (X19)

Y1

X1

0.65

0.30

NOM

C1

Contact Pad Spacing

3.10

Contact Pad to Contact Pad (X14)

G1

0.20

Thermal Via Diameter

V

0.33

C4

Contact Pad to Thermal Via (X2)

1.38

C3

Contact Pad to Thermal Via (X2)

1.03

Center Pad to Center Pad

G2

0.27

SILK SCREEN

1

2

19

Microchip Technology Drawing C04-3273 Rev A

19-Lead Very Thin Plastic Quad Flat, No Lead Package (Q8A) - 3x3x0.9 mm Body [VQFN]

With Dual Exposed Pads