LMK6C datasheet(33/56 Pages) TI

номер детали	LMK6C

подробное описание детали	LMK6x Low Jitter, High-Performance BAW Oscillator

PDF	56 Pages

Scroll/Zoom	100%

производитель	TI [Texas Instruments]

домашняя страница	http://www.ti.com

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33 / 56 page

10.4.1.2 Recommended Solder Reflow Profile

TI recommends following the solder paste supplier's recommendations to optimize flux activity and to achieve

proper melting temperatures of the alloy within the guidelines of J-STD-20. It is preferable for the LMK6x to

be processed with the lowest peak temperature possible while also remaining below the components peak

temperature rating as listed on the MSL label. The exact temperature profile would depend on several factors

including maximum peak temperature for the component as rated on the MSL label, Board thickness, PCB

material type, PCB geometries, component locations, sizes, densities within PCB, as well solder manufactures

recommended profile, and capability of the reflow equipment to as confirmed by the SMT assembly operation.

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LMK6C, LMK6D, LMK6H, LMK6P

SNAS826D – APRIL 2022 – REVISED FEBRUARY 2023

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LMK6C датащи(PDF) 33 Page - Texas Instruments