T4-LDS-0193, Rev. 2 (111899)

©2011 Microsemi Corporation

Page 1 of 6

1N6309 thru 1N6355D

Available on

commercial

versions

VOIDLESS HERMETICALLY SEALED

500mW GLASS ZENER DIODES

Qualified per MIL-PRF-19500/533

Qualified Levels:

JAN, JANTX, JANTXV

and JANS

DESCRIPTION

This Zener voltage regulator series is military qualified and is ideal for high-reliability

applications where a failure cannot be tolerated. These industry-recognized 0.5 watt Zener

voltage regulators are hermetically sealed with voidless-glass construction using an internal

metallurgical bond. It includes Zener selections from 2.4 to 200 volts in standard 5%

tolerances as well as 1% and 2% tolerances. They are also available in surface-mount

packages. Microsemi also offers numerous other Zener products to meet higher and lower

power ratings in both thru-hole and surface mount packages.

DO-35 or

“D” Package

Also available in:

“B” SQ MELF package

(surface mount)

1N6309US – 1N6355DUS

Important: For the latest information, visit our website http://www.microsemi.com.

FEATURES

•

JEDEC registered 1N6309 thru 1N6355 series.

•

Voltage tolerances of 1%, 2% and 5% are available. (See part nomenclature.)

•

Voidless hermetically sealed glass package.

•

Internal “Category 1” metallurgical bonds for 1N6321 thru 1N6355 and “Category III” for 1N6309

thru 1N6320.

•

JAN, JANTX, JANTXV, and JANS reliability levels are available per MIL-PRF-19500/533.

•

RoHS compliant versions available (commercial grade only).

APPLICATIONS / BENEFITS

•

Small DO-35 size package (or “D” Package).

•

Regulates voltage over a broad operating current and temperature range.

•

Extensive selection from 2.4 to 200 volts.

•

Standard and tight voltage tolerances available.

•

Extremely robust construction.

•

Flexible axial-lead mounting terminals.

•

Non-sensitive to ESD per MIL-STD-750 method 1020.

•

Inherently radiation hard as described in Microsemi “MicroNote 050”.

MAXIMUM RATINGS

MSC – Lawrence

6 Lake Street,

Lawrence, MA 01841

Tel: 1-800-446-1158 or

(978) 620-2600

Fax: (978) 689-0803

MSC – Ireland

Gort Road Business Park,

Ennis, Co. Clare, Ireland

Tel: +353 (0) 65 6840044

Fax: +353 (0) 65 6822298

Website:

www.microsemi.com

Parameters/Test Conditions

Symbol

Value

Unit

Junction and Storage Temperature

TJ and TSTG

-65 to +175

oC

Thermal Resistance Junction-to-Lead

(1)

1N6309 – 1N6320

1N6321 – 1N6355

RӨJL

150

95.5

oC/W

Thermal Resistance Junction-to-Ambient

(2)

RӨJA

240

oC/W

Steady-State Power Dissipation @ TL = 75

oC

PD

0.5

W

Forward Voltage @ 1.0 A

VF

1.4

V

Solder Temperature @ 10 s

TSP

260

oC

Notes: 1. At 3/8 inch (10 mm) from body. See Figure 1 and Figure 2 for derating.

2. TA = +55 °C before derating on printed circuit board (PCB), PCB = FR4 .0625 inch (1.59 mm) 1-layer 1-

Oz Cu, horizontal, still air, pads = .092 inch (2.34 mm) diameter, strip = .030 inch (0.76 mm) x 1 inch

(

25.4 mm) long, axial lead length L ≤ .187 inch (≤ 4.75 mm); RΘJA with a defined thermal resistance

condition included is measured at IZ = as defined in the characteristics and ratings table herein.