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NVSW519AT датащи(PDF) 39 Page - NICHIA CORPORATION |
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NVSW519AT датащи(HTML) 39 Page - NICHIA CORPORATION |
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39 / 44 page ![]() NICHIA STS-DA1-6102D <Cat.No.210816> 38 RELIABILITY (1) Tests and Results Test Reference Standard Test Conditions Test Duration Failure Criteria # Units Failed/Tested Resistance to Soldering Heat (Reflow Soldering) JEITA ED-4701 300 301 Tsld=260°C, 10sec, 2reflows, Precondition: 30°C, 70%RH, 168hr #1 0/22 Solderability JEITA ED-4701 303 303A Tsld=245±5°C, 5sec, Lead-free Solder(Sn-3.0Ag-0.5Cu) #2 0/22 Thermal Shock(Air to Air) -40°C to 105°C, 15min dwell 100cycles #1 0/22 Moisture Resistance (Cyclic) JEITA ED-4701 200 203 25°C~65°C~-10°C, 90%RH, 24hr per cycle 10cycles #1 0/22 High Temperature Storage JEITA ED-4701 200 201 TA=105°C 1000hours #1 0/22 Temperature Humidity Storage JEITA ED-4701 100 103 TA=60°C, RH=90% 1000hours #1 0/22 Low Temperature Storage JEITA ED-4701 200 202 TA=-40°C 1000hours #1 0/22 Room Temperature Operating Life TA=25°C, IF=2200mA Test board: See NOTES below 1000hours #1 0/22 High Temperature Operating Life TA=105°C, IF=900mA Test board: See NOTES below 1000hours #1 0/22 Temperature Humidity Operating Life 60°C, RH=90%, IF=1800mA Test board: See NOTES below 500hours #1 0/22 Low Temperature Operating Life TA=-40°C, IF=1400mA Test board: See NOTES below 1000hours #1 0/22 Electrostatic Discharges ANSI/ESDA/ JEDEC JS-001 HBM, 8kV, 1.5kΩ, 100pF, 1pulse, alternately positive or negative #1 0/22 NOTES: 1) Test board: Al board thickness=1.5mm, copper layer thickness=0.105mm, RθJA≈15°C/W 2) Measurements are performed after allowing the LEDs to return to room temperature. (2) Failure Criteria Criteria # Items Conditions Failure Criteria #1 Forward Voltage(VF) IF=1400mA >Initial value×1.1 Luminous Flux(Φv) IF=1400mA <Initial value×0.7 #2 Solderability - Less than 95% solder coverage |
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