SX-SDPAC

802.11a/b/g/n/ac plus Bluetooth

SDIO System-in-Package (SiP) Module

Silex SX-SDPAC is a dual-band 1x1 802.11a/b/g/n/ac plus Bluetooth

5.0+HS “Smart Ready” SDIO SiP module based on the Qualcomm

Atheros QCA9377 System-on-Chip (SoC). It integrates a QCA9377 SoC

and a single-ended integrated RF front end including diplexer and

coupler. These allow a single external antenna to be used for both

5GHz and 2.4GHz bands internally.

SX-SDPAC supports 802.11ac Wave 2 multi-user MIMO (MU-MIMO)

feature for high performance and increased capacity. SX-SDPAC

provides an SDIO3.0 interface for WLAN and a hi-speed UART

interface for BT. The compact SiP module measures 6.9 mm x 6.9 mm

thus reducing cost and area. 1.5KBytes of on-chip one-time-program-

mable (OTP) memory eliminates the need for an external ash and

further reduces BOM cost.

The SX-SDPAC is a System-in-Package (SiP) designed to be mounted

directly on the device PCBA. This design approach minimizes cost by

eliminating extra materials and labor associated with a radio module

or card. In order to expedite your product development process, Silex

can provide both hardware and software engineering services

including custom driver development.

PN: 141-20135-110

REV D 20200327

Dual-Band 1x1 802.11ac SiP Module for Wi-Fi & Bluetooth

silex technology is a registered trademark of silex technology, Inc. Other product or brand names may be registered trademarks or trademarks of their respective owners.

Technical information and specications are subject to change without notice. © 2020 silex technology, Inc. All rights reserved.

silex global sales & support locations

US O ce

silex technology america, Inc.

+1-801-748-1199

US toll free 866-765-8761

www.silexamerica.com

sales@silexamerica.com

Europe O ce

silex technology europe, GmbH

+49-2154-88967-0

Germany toll free 0800-7453938

www.silexeurope.com

sales@silexeurope.com

Corporate Headquarters

silex technology, Inc.

+81-774-98-3781

www.silex.jp

support@silex.jp

SX-SDPAC-2830

Chipset

Host Interface

Reference Driver

Temperature Range

SDIO3.0: WLAN

Hi-speed UART: Bluetooth

Qualcomm Atheros QCA9377

1x1 mode (1T1R)

Specications:

Radio Specications

Dimensions

6.9mm (L) x 6.9mm (W) x 1.082mm (H)

-20°C to +80°C [Case Temperature]

Linux, Windows, Android

Baseband Specications

CSMA/CA media access; DSSS, OFDM

Weight

Operating Voltage

Product Name

Antenna Conguration

3.30 VDC +/- 5%

I802.11b/g/n: 2.412 - 2.484 GHz

802.11a/n/ac: 4.9 - 5.925 GHz

Bluetooth: 2.402 – 2.480 GHz

Key Features:

• LowPowerDual-Band1x1SiPModuleforWi-Fi&BT

• BasedontheQCA9377Chipset

• 802.11a/b/g/n/acWave2MU-MIMO

• SDIO3.0WLANHostInterface

• UART/PCMBTInterface

• On-chipPowerManagementUnit(PMU)

• Single3.3VSupply(I/OSupply1.8Vor3.3V)

• Internal48MHzXTAL

• AntennaDiversitySupportcontrolledbysignalpins

• Single-endedIntegratedRFFront-endDesign

• Minimalhostutilization(11acspeeds)viaooading

Bluetooth Specications

BT4.1 + HS “Smart Ready” BLE

Compatible with BT1.x, 2.x, & EDR

Diagram:

Contact sales@silexamerica.com to learn how you can start

evaluations on the SX-SDPAC-2830 SiP.

India O ce

silex technology india, Pvt. Ltd.,.

+91-44-43033234

www.silex-india.com

support@silex-india.com