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MCP2518FD датащи(PDF) 89 Page - Microchip Technology

номер детали MCP2518FD
подробное описание детали  External CAN FD Controller with SPI Interface
PDF  96 Pages
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производитель  MICROCHIP [Microchip Technology]
домашняя страница  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP2518FD датащи(HTML) 89 Page - Microchip Technology

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 2019 Microchip Technology Inc.
DS20006027A-page 89
MCP2518FD
RECOMMENDED LAND PATTERN
Dimension Limits
Units
Optional Center Pad Width
Optional Center Pad Length
Contact Pitch
Y2
X2
4.25
1.70
MILLIMETERS
0.65 BSC
MIN
E
MAX
Contact Pad Length (X14)
Contact Pad Width (X14)
Y1
X1
0.80
0.35
Microchip Technology Drawing C04-23361 Rev B
NOM
14-Lead Very Thin Plastic Dual Flat, No Lead Package (QBB) - 4.5x3 mm Body [VDFN]
12
14
C
Contact Pad Spacing
3.00
Contact Pad to Center Pad (X14)
G1
0.20
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.30
1.00
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
With 1.6x4.2 mm Exposed Pad and Stepped Wettable Flanks
C
E
X1
Y2
ØV
Y1
G1
EV
SILK SCREEN
G2
Contact Pad to Center Pad (X12)
G2
0.20
Pin 1 Index Chamfer
CH
X2
EV
0.30
CH



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