PACKAGING INFORMATION

Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

TLV0834CD

ACTIVE

SOIC

D

14

50

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLV0834CDR

ACTIVE

SOIC

D

14

2500

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLV0834CN

ACTIVE

PDIP

N

14

25

Pb-Free

(RoHS)

CU NIPDAU

Level-NC-NC-NC

TLV0834CPW

ACTIVE

TSSOP

PW

16

70

None

CU NIPDAU

Level-1-220C-UNLIM

TLV0834CPWR

ACTIVE

TSSOP

PW

16

2000

None

CU NIPDAU

Level-1-220C-UNLIM

TLV0834ID

ACTIVE

SOIC

D

14

50

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLV0834IDR

ACTIVE

SOIC

D

14

2500

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLV0834IN

ACTIVE

PDIP

N

14

25

Pb-Free

(RoHS)

CU NIPDAU

Level-NC-NC-NC

TLV0834IPW

ACTIVE

TSSOP

PW

16

90

None

CU NIPDAU

Level-1-220C-UNLIM

TLV0834IPWR

ACTIVE

TSSOP

PW

16

2000

None

CU NIPDAU

Level-1-220C-UNLIM

TLV0838CDW

ACTIVE

SOIC

DW

20

25

Pb-Free

(RoHS)

CU NIPDAU

Level-2-250C-1YEAR/

Level-1-220C-UNLIM

TLV0838CDWR

ACTIVE

SOIC

DW

20

2000

Pb-Free

(RoHS)

CU NIPDAU

Level-2-250C-1YEAR/

Level-1-220C-UNLIM

TLV0838CN

ACTIVE

PDIP

N

20

20

Pb-Free

(RoHS)

CU NIPDAU

Level-NA-NA-NA

TLV0838CPW

ACTIVE

TSSOP

PW

20

70

None

CU NIPDAU

Level-1-220C-UNLIM

TLV0838CPWR

ACTIVE

TSSOP

PW

20

2000

None

CU NIPDAU

Level-1-220C-UNLIM

TLV0838IDW

ACTIVE

SOIC

DW

20

25

Pb-Free

(RoHS)

CU NIPDAU

Level-2-250C-1YEAR/

Level-1-220C-UNLIM

TLV0838IDWR

ACTIVE

SOIC

DW

20

2000

Pb-Free

(RoHS)

CU NIPDAU

Level-2-250C-1YEAR/

Level-1-220C-UNLIM

TLV0838IN

ACTIVE

PDIP

N

20

20

Pb-Free

(RoHS)

CU NIPDAU

Level-NA-NA-NA

TLV0838IPW

ACTIVE

TSSOP

PW

20

70

None

CU NIPDAU

Level-1-220C-UNLIM

TLV0838IPWR

ACTIVE

TSSOP

PW

20

2000

None

CU NIPDAU

Level-1-220C-UNLIM

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

product content details.

None: Not yet available Lead (Pb-Free).

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,

including bromine (Br) or antimony (Sb) above 0.1% of total product weight.

PACKAGE OPTION ADDENDUM

www.ti.com

22-Feb-2005

Addendum-Page 1