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EM4150

EM4350

Ordering Information

Die Form

This chart shows general offering; for detailed Part Number to order, please see the table “Standard Versions” below.

-

Circuit Nb:

Customer Version:

EM4150: standard pads

%%% = only for custom specific version

EM4350: mega pads

Version:

Bumping:

A6 = Manchester, 64 clocks per bit

" " (blank) = no bumps

A5 = Manchester, 32 clocks per bit

E = with Gold Bumps (Note 2)

Die form:

Thickness:

WW = Wafer

6 = 6 mils (152um)

WS = Sawn Wafer/Frame

7 = 7 mils (178um)

WT = Sticky Tape

11 = 11 mils (280um)

WP = Waffle Pack (note 1)

21 = 21 mils (533um)

27 = 27 mils (686um)

EM4150 A6 WS 11

%%%

Packaged Devices

This chart shows general offering; for detailed Part Number to order, please see the table “Standard Versions” below.

-

Circuit Nb:

Customer Version:

EM4150: standard pads

%%% = only for custom specific version

Version:

A6 = Manchester, 64 clocks per bit

A5 = Manchester, 32 clocks per bit

Package/Card & Delivery Form:

CI2LB = CID Pack, 2 long pins (2.5mm), in tape

CI2LC = CID Pack, 2 long pins (2.5mm), in bulk

CI2SB = CID Pack, 2 short pins (1.25mm), in tape

CI2SC = CID Pack, 2 short pins (1.25mm), in bulk

CB2RC = PCB Package, 2 pins, in bulk

SO8A = SO-8 Package, in stick (note 1)

CI2LC

%%%

EM4150 A6

Remarks:

•

For ordering please use table of “Standard Version” table below.

•

For specifications of Delivery Form, including gold bumps, tape and bulk, as well as possible other delivery form or

packages, please contact EM Microelectronic-Marin S.A.

•

Note 1:

This is a non-standard package. Please contact EM Microelectronic-Marin S.A for availability.

•

Note 2:

EM4350 is preferably used with gold bumps. Use of EM4150 with gold bump together with direct technology is

subject to license, please contact EM Sales Office.

Copyright

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