TSOP936..P10TR

www.vishay.com

Vishay Semiconductors

Rev. 1.1, 05-Aug-2021

9

Document Number: 82875

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

ASSEMBLY INSTRUCTIONS

Reflow Soldering

• Reflow soldering must be done within 72 h while stored

under a max. temperature of 30 °C, 60 % RH after

opening the dry pack envelope

• Set the furnace temperatures for pre-heating and heating

in accordance with the reflow temperature profile as

shown in the diagram. Exercise extreme care to keep the

maximum temperature below 260 °C. The temperature

shown in the profile means the temperature at the device

surface. Since there is a temperature difference between

the component and the circuit board, it should be verified

that the temperature of the device is accurately being

measured

• Handling after reflow should be done only after the work

surface has been cooled off

Manual Soldering

• Use a soldering iron of 25 W or less. Adjust the

temperature of the soldering iron below 300 °C

• Finish soldering within 3 s

• Handle products only after the temperature has cooled

off

VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE

LABEL

Standard bar code labels for finished goods

The standard bar code labels are product labels and used for identification of goods. The finished goods are packed in final

packing area. The standard packing units are labeled with standard bar code labels before transported as finished goods to

warehouses. The labels are on each packing unit and contain Vishay Semiconductor GmbH specific data.

max. 120 s

max. 100 s

max. 20 s

Max. ramp up 3 °C/s

max. 260 °C

10

100

1000

10000

0

50

100

250

300

0

300

Axis Title

Time (s)

250

200

150

100

50

200

150

245 °C

217 °C

240 °C

255 °C

Max. ramp down 6 °C/s

Max. 2 cycles allowed

19800