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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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LSF0102DDFR датащи(PDF) 51 Page - Texas Instruments |
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LSF0102DDFR датащи(HTML) 51 Page - Texas Instruments |
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51 / 57 page  www.ti.com PACKAGE OUTLINE C 4.25 3.75 TYP 1.3 1.0 6X 0.65 8X 0.30 0.15 2X 1.95 (0.15) TYP 0 - 8 0.1 0.0 0.25 GAGE PLANE 0.6 0.2 A 3.15 2.75 NOTE 3 B 2.9 2.7 NOTE 4 4220784/C 06/2021 SSOP - 1.3 mm max height DCT0008A SMALL OUTLINE PACKAGE NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 1 8 0.13 C A B 5 4 PIN 1 ID AREA SEATING PLANE 0.1 C SEE DETAIL A DETAIL A TYPICAL SCALE 3.500 |
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