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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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74F113 датащи(PDF) 4 Page - NXP Semiconductors |
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74F113 датащи(HTML) 4 Page - NXP Semiconductors |
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4 / 10 page  Philips Semiconductors Product specification 74F113 Dual J-K negative edge-triggered flip-flops without reset 1996 Mar 14 4 DC ELECTRICAL CHARACTERISTICS (Over recommended operating free-air temperature range unless otherwise noted.) SYMBOL PARAMETER TEST CONDITIONS1 LIMITS UNIT SYMBOL PARAMETER TEST CONDITIONS1 MIN TYP2 MAX UNIT VO High level output voltage VCC = MIN, VIL = MAX, IO = MAX ±10%V CC 2.5 V VOH High-level output voltage VCC MIN, VIL MAX, VIH = MIN IOH = MAX ±5%V CC 2.7 3.4 V VO Low level output voltage VCC = MIN, VIL = MAX, IO = MAX ±10%V CC 0.30 0.50 V VOL Low-level output voltage VCC MIN, VIL MAX, VIH = MIN IOL = MAX ±5%V CC 0.30 0.50 V VIK Input clamp voltage VCC = MIN, II = IIK –0.73 –1.2 V II Input current at maximum input voltage VCC = MAX, VI = 7.0V 100 µA IIH High-level input current VCC = MAX, VI = 2.7V 20 µA Jn, Kn –0.6 mA IIL Low-level input current CPn VCC = MAX, VI = 0.5V –2.4 mA SDn –3.0 mA IOS Short-circuit output current3 VCC = MAX -60 –150 mA ICC Supply current4 (total) VCC = MAX 15 21 mA NOTES: 1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type. 2. All typical values are at VCC = 5V, Tamb = 25°C. 3. Not more than one output should be shorted at a time. For testing IOS, the use of high-speed test apparatus and/or sample-and-hold techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any sequence of parameter tests, IOS tests should be performed last. 4. Measure ICC with the clock input grounded and all outputs open, then with Q and Q outputs high in turn. AC ELECTRICAL CHARACTERISTICS LIMITS SYMBOL PARAMETER TEST CONDITION VCC = +5.0V Tamb = +25°C CL = 50pF RL = 500Ω VCC = +5.0V ± 10% Tamb = 0°C to +70°C CL = 50pF RL = 500Ω VCC = +5.0V ± 10% Tamb = –40°C to +85°C CL = 50pF RL = 500Ω UNIT MIN TYP MAX MIN MAX MIN MAX fmax Maximum clock frequency Waveform 1 85 100 80 80 ns tPLH tPHL Propagation delay CPn to Qn or Qn Waveform 1 2.0 2.0 4.0 4.0 6.0 6.0 2.0 2.0 7.0 7.0 2.0 2.0 7.5 7.0 ns tPLH tPHL Propagation delay SDn, to Qn or Qn Waveform 2 2.0 2.0 4.5 4.5 6.5 6.5 2.0 2.0 7.5 7.5 2.0 2.0 8.0 7.5 ns AC SETUP REQUIREMENTS LIMITS SYMBOL PARAMETER TEST CONDITION VCC = +5.0V Tamb = +25°C CL = 50pF RL = 500Ω VCC = +5.0V ± 10% Tamb = 0°C to +70°C CL = 50pF RL = 500Ω VCC = +5.0V ± 10% Tamb = –40°C to +85°C CL = 50pF RL = 500Ω UNIT MIN TYP MAX MIN MAX MIN MAX tsu (H) tsu(L) Setup time, high or low Jn, Kn to CPn Waveform 1 4.0 3.5 5.0 4.0 5.0 4.5 ns th (H) th (L) Hold time, high or low Jn, Kn to CPn Waveform 1 0.0 0.0 0.0 0.0 0.0 0.0 ns tw (H) tw (L) CP pulse width, high or low Waveform 1 4.5 4.5 5.0 5.0 5.0 5.0 ns tw (L) SDn pulse width, low Waveform 2 4.5 5.0 5.0 ns trec Recovery time SDn to CPn Waveform 2 4.5 5.0 5.0 ns |
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