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LM3489 датащи(PDF) 14 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor. Click here to check the latest version.
номер детали LM3489
подробное описание детали  Hysteretic PFET Buck Controller with Enable Pin
PDF  15 Pages
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производитель  NSC [National Semiconductor (TI)]
домашняя страница  http://www.national.com
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LM3489 датащи(HTML) 14 Page - National Semiconductor (TI)

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Design Information (Continued)
INTERFACING WITH THE ENABLE PIN
The enable pin is internally pulled high with clamping at 8V
typical. For normal operation this pin should be left open. To
disable the device, the enable pin should be connected to
ground externally. If an external voltage source is applied to
this pin for enable control, the applied voltage should not
exceed the maximum operating voltage level specified in this
datasheet, i.e. 5.5V. For most applications, an open drain or
open collector transistor can be used to short this pin to
ground to shutdown the device .
PCB Layout
The PCB board layout is very important in all switching
regulator designs. Poor layout can cause switching noise
into the feedback signal and generate EMI problems. For
minimal inductance, the wires indicated by heavy lines in
schematic diagram should be as wide and short as possible.
Keep the ground pin of the input capacitor as close as
possible to the anode of the catch diode. This path carries a
large AC current. The switching node, the node with the
diode cathode, inductor and FET drain should be kept short.
This node is one of the main sources for radiated EMI since
it sees a large AC voltage at the switching frequency. It is
always a good practice to use a ground plane in the design,
particularly for high current applications.
The two ground pins, PGND and GND, should be connected
by as short a trace as possible. They can be connected
underneath the device. These pins are resistively connected
internally by approximately 50
Ω. The ground pins should be
tied to the ground plane, or to a large ground trace in close
proximity to both the FB divider and C
OUT grounds.
The gate pin of the external PFET should be located close to
the PGATE pin. However, if a very small FET is used, a
resistor may be required between PGATE pin and the gate of
the PFET to reduce high frequency ringing. Since this resis-
tor will slow down the PFET’s rise time, the current limit
blanking time should be taken into consideration (refer to
Current Limiting Operation). The feedback voltage signal line
can be sensitive to noise. Avoid inductive coupling with the
inductor or the switching node. The FB trace should be kept
away from those areas. Also, the orientation of the inductor
can contribute un-wanted noise coupling to the FB path. If
noise problems are observed it may be worth trying a differ-
ent orientation of the inductor and select the best for final
component placement.
20186953
FIGURE 7. Typical Application Schematic for VOUT = 3.3V/500mA
www.national.com
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