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MCP960X датащи(PDF) 51 Page - Microchip Technology

номер детали MCP960X
подробное описание детали  Thermocouple EMF to Temperature Converter, ±1.5°C Maximum Accuracy
PDF  57 Pages
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производитель  MICROCHIP [Microchip Technology]
домашняя страница  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP960X датащи(HTML) 51 Page - Microchip Technology

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 2015-2021 Microchip Technology Inc.
DS20005426G-page 51
MCP960X/L0X/RL0X
RECOMMENDED LAND PATTERN
Microchip Technology Drawing C04-186B
20-Lead More Thin Plastic Quad Flat, No Lead Package (NU) - 5x5x1.0 mm Body
SILK SCREEN
1
2
20
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.30
1.00
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Dimension Limits
Units
C1
Optional Center Pad Width
Contact Pad Spacing
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
C2
Y2
X2
3.35
3.35
MILLIMETERS
0.65 BSC
MIN
E
MAX
4.50
4.50
Contact Pad Length (X20)
Contact Pad Width (X20)
Y1
X1
0.55
0.40
G
Distance Between Pads
0.20
NOM
[MQFN] - (Also called VQFN)
C1
C2
EV
EV
E
X2
Y2
ØV
G
Y1
X1



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