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ATECC608A датащи(PDF) 72 Page - Microchip Technology

номер детали ATECC608A
подробное описание детали  ATECC608A for LoRaWAN™ Data Sheet
PDF  81 Pages
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производитель  MICROCHIP [Microchip Technology]
домашняя страница  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

ATECC608A датащи(HTML) 72 Page - Microchip Technology

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RECOMMENDED LAND PATTERN
Dimension Limits
Units
Optional Center Pad Width
Optional Center Pad Length
Contact Pitch
Y2
X2
1.40
1.60
MILLIMETERS
0.50 BSC
MIN
E
MAX
Contact Pad Length (X8)
Contact Pad Width (X8)
Y1
X1
0.85
0.30
NOM
1
2
8
C
Contact Pad Spacing
2.90
Contact Pad to Center Pad (X8)
G1
0.33
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.30
1.00
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
© 2017 Microchip Technology Inc.
Microchip Technology Drawing C04-23355-Q4B Rev B
8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN]
Atmel Legacy Global Package Code YNZ
X2
Y2
Y1
SILK SCREEN
X1
E
C
EV
G2
G1
ØV
Contact Pad to Contact Pad (X6)
G2
0.20
ATECC608A-TNGLoRaWAN
Package Drawings
© 2020 Microchip Technology Inc.
Complete Datasheet
DS40002154B-page 72



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