1 Watt Power Amplifier

4.9 - 6.0 GHz

MAAPSS0096

M/A-COM Inc. and its affiliates reserve the right to make changes to the

product(s) or information contained herein without notice. M/A-COM makes

no warranty, representation or guarantee regarding the suitability of its

products for any particular purpose, nor does M/A-COM assume any liability

whatsoever arising out of the use or application of any product(s) or

information.

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North America Tel: 800.366.2266 / Fax: 978.366.2266

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Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

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Visit www.macom.com for additional data sheets and product information.

V1

3

RoHS

Compliant

Notes on board design

1.

for circuit board. Dielectric thickness is not critical

but RFin and RFout transmission lines should be 50

ohms (w = 22 mil for thickness = 10 mil).

2.

Solder the exposed paddle on the back of the pack-

age to the board. Proper attachment of the exposed

paddle is essential for RF and DC ground in addition

to providing a low thermal resistance.

3.

Case temperature (Tc) is

measured on the top

circuit board metal as close to the body of the

package as possible (see sample board drawing).

4.

The board must provide adequate heat sinking to

accommodate the 2.5 W typically dissipated under

small signal conditions. Sample board uses vias in

the vicinity of the ground pad to provide a suitable

heat sink connected to the ground plane of the

board as shown above.

5.

Placement of C1, C2 and R1 are not critical but use

of size 1206 for the bypass caps (C1 and C2) is

critical.

Sample Board

Application Information

C2

C1

R1

Plated Vias

Plated Vias

1000006973