XLAMP® XP-G3 LED

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CLD-DS139

REV 9

36

REFLOW SOLDERING CHARACTERISTICS

In testing, Cree LED has found XLamp XP‑G3 LEDs to be compatible with JEDEC J‑STD‑020C, with the exception of the peak temperature

requirements listed in the table below. As a general guideline, Cree LED recommends that users follow the recommended soldering

profile provided by the manufacturer of the solder paste used, and therefore it is the lamp or luminaire manufacturer’s responsibility to

determine applicable soldering requirements.

Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.

Profile Feature

Lead-Free Solder

Average Ramp‑Up Rate (Ts

max to Tp)

1.2 °C/second

Preheat: Temperature Min (Ts

min)

120 °C

Preheat: Temperature Max (Ts

max)

170 °C

Preheat: Time (ts

min to tsmax)

65‑150 seconds

Time Maintained Above: Temperature (T

L)

217 °C

Time Maintained Above: Time (t

L)

45‑90 seconds

Peak/Classification Temperature (Tp)

235 ‑ 245 °C

Time Within 5 °C of Actual Peak Temperature (tp)

20‑40 seconds

Ramp-Down Rate

1 ‑ 6 °C/second

Time 25 °C to Peak Temperature

4 minutes max.

Note: All temperatures refer to topside of the package, measured on the package body surface.

T

P

T

L

Time

t 25˚C to Peak

Preheat

ts

t

S

t

P

25

Ramp-down

Ramp-up

Critical Zone

T

L to TP

Ts

max

Ts

min