HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : IC200403

Issued Date : 2004.03.01

Revised Date : 2004.08.31

Page No. : 9/10

H78LXXAM / BM, H78LXXAA / BA

HSMC Product Specification

TO-92 Dimension

SOT-89 Dimension

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.

• HSMC reserves the right to make changes to its products without notice.

• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Head Office And Factory:

• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.

Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454

• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C

Tel: 886-3-5983621~5 Fax: 886-3-5982931

3

2

1

A

B

C

D

E

F

G

H

I

3

1

A

D

B

C

I

E

G

H

2

F

Marking:

Pb Free Mark

Pb-Free: "

Normal: None

Control Code

Date Code

HA

78 L

Product Series

(05,06,08,09,12)

Note: Green label is used for pb-free packing

Pin Style: 1.Output 2.Ground 3.Input

Material:

• Lead solder plating: Sn60/Pb40 (Normal),

Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)

• Mold Compound: Epoxy resin family,

flammability solid burning class: UL94V-0

DIM

Min.

Max.

A

4.33

4.83

B

4.33

4.83

C

12.70

-

D

0.36

0.56

E-

*1.27

F

3.36

3.76

G

0.36

0.56

H-

*2.54

I-

*1.27

α1

-

*5

°

α2

-

*2

°

α3

-

*2

°

*: Typical, Unit: mm

3-Lead TO-92 Plastic Package

HSMC Package Code: A

DIM

Min.

Max.

A

4.40

4.60

B

4.05

4.25

C

1.50

1.70

D

2.40

2.60

E

0.36

0.51

F*1.50

-

G*3.00

-

H

1.40

1.60

I

0.35

0.41

*: Typical, Unit: mm

Marking:

Date Code

Control Code

H

Product Series

(05,06,08,09,12)

78 L

Pb Free Mark

Pb-Free: "

Normal: None

Note: Green label is used for pb-free packing

Pin Style: 1.Output 2.Ground 3.Input

Material:

• Lead solder plating: Sn60/Pb40 (Normal),

Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)

• Mold Compound: Epoxy resin family,

flammability solid burning class: UL94V-0

3-Lead SOT-89 Plastic

Surface Mounted Package

HSMC Package Code: M