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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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LTC2864 датащи(PDF) 21 Page - Analog Devices |
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LTC2864 датащи(HTML) 21 Page - Analog Devices |
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21 / 24 page  LTC2862A 21 Rev. A For more information www.analog.com PACKAGE DESCRIPTION 3.00 ±0.10 (4 SIDES) NOTE: 1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1) 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON TOP AND BOTTOM OF PACKAGE 0.40 ±0.10 BOTTOM VIEW—EXPOSED PAD 1.65 ±0.10 (2 SIDES) 0.75 ±0.05 R = 0.125 TYP 2.38 ±0.10 1 4 8 5 PIN 1 TOP MARK (NOTE 6) 0.200 REF 0.00 – 0.05 (DD8) DFN 0509 REV C 0.25 ±0.05 2.38 ±0.05 RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 1.65 ±0.05 (2 SIDES) 2.10 ±0.05 0.50 BSC 0.70 ±0.05 3.5 ±0.05 PACKAGE OUTLINE 0.25 ±0.05 0.50 BSC DD Package 8-Lead Plastic DFN (3mm × 3mm) (Reference LTC DWG # 05-08-1698 Rev C) |
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