BARE DIE PACKING OPTIONS

UNSAWN WAFER

WN: Full wafer, unsawn, 100% tested with reject die inked.

(example: CP211-PART NUMBER-WN)

SAWN WAFER ON PLASTIC RING

WR: Full wafer, sawn and mounted on plastic ring,

100% tested with reject die inked.

(example: CP211-PART NUMBER-WR)

Please note: Sawn Wafer on Metal Frame (WS)

is possible as a special order. Please contact your

Central Sales Representative at 631-435-1110.

Visit the Central website for a complete listing of specifications:

www.centralsemi.com/bdspecs

BARE DIE IN TRAY (WAFFLE) PACK

CT: Singulated die in tray (waffle) pack.

(example: CP211-PART NUMBER-CT)

CM: Singulated die in tray (waffle) pack 100% visually inspected as

per MIL-STD-750, (method 2072 transistors, method 2073 diodes).

(example: CP211-PART NUMBER-CM)

R2 (3-April 2017)

www.centra lsemi.com