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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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MIC2133 датащи(PDF) 9 Page - Microchip Technology |
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MIC2133 датащи(HTML) 9 Page - Microchip Technology |
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9 / 50 page  2022 Microchip Technology Inc. and its subsidiaries DS20006653B-page 9 MIC2133 TEMPERATURE SPECIFICATIONS Parameters Symbol Min. Typ. Max. Units Conditions Temperature Ranges Operating Junction Temperature Range TJ -40 — +125 °C Note 1 Maximum Junction Temperature TJ(ABSMAX) — — +150 °C — Storage Temperature TS -65 — +150 °C — Lead Temperature TLEAD — — +300 °C Soldering, 10s Package Thermal Resistance Thermal Resistance, 5 mm x 5 mm, 32-Lead VQFN JC — 2 — °C/W Junction to Case Thermal Resistance, 5 mm x 5 mm, 32-Lead VQFN JA — 34 — °C/W Junction to Ambient Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. |
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