DGD0636M

Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Value

Unit

High-Side Floating Supply Voltage

VB

-0.3 to +124

V

High-Side Floating Supply Offset Voltage

VS

VB-24 to VB+0.3

V

High-Side Floating Output Voltage

VHO

VS-0.3 to VB+0.3

V

Low-Side Output Voltage

VLO

-0.3 to VCC+0.3

V

Offset Supply Voltage Transient

dVS / dt

50

V/ns

Low-Side Fixed Supply Voltage

VCC

-0.3 to +24

V

Logic Input Voltage (HIN*, LIN*, ITRIP, EN and FO*)

VIN

-0.3 to +5.5

V

Thermal Characteristics (@TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Value

Unit

Power Dissipation Linear derating factor (Note 5)

PD

2.3

W

Thermal Resistance, Junction to Ambient (Note 5)

RϴJA

60

°C/W

Thermal Resistance, Junction to Case (Note 5)

RϴJC

45

°C/W

Operating Temperature

TJ

+150

°C

Lead Temperature (soldering, 10s)

TL

+300

Storage Temperature Range

TSTG

-55 to +150

Note:

5. When mounted on a standard JEDEC 2-layer FR-4 board.

Recommended Operating Conditions

Parameter

Symbol

Min

Max

Unit

High-Side Floating Supply Absolute Voltage

VB

VS + 10

VS + 20

V

High-Side Floating Supply Offset Voltage

VS

(Note 6)

100

V

High-Side Floating Output Voltage

VHO

VS

VB

V

Low-Side Fixed Supply Voltage

VCC

10

20

V

Low-Side Output Voltage

VLO

COM

VCC

V

Logic Input Voltage (HIN*, LIN*, ITRIP & EN)

VIN

VSS

5

V

Fault Output Voltage

VFO

VSS

VCC

V

Logic Ground

VSS

-5

5

V

Ambient Temperature

TA

-40

+125

°C

Note:

6. Logic operation for VS of -5V to +100V.

DGD0636M

Document Number DS41731 Rev. 1 – 2

4 of 12

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February 2019

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