CPD71 datasheet(1/2 Pages) CENTRAL

номер детали	CPD71

подробное описание детали	Low Leakage Diode Low Leakage Switching Diode Chip

PDF	2 Pages

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производитель	CENTRAL [Central Semiconductor Corp]

домашняя страница	http://www.centralsemi.com

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1 / 2 page

Central

Semiconductor Corp.

TM

PROCESS

CPD71

Low Leakage Diode

Low Leakage Switching Diode Chip

PRINCIPAL DEVICE TYPES

CMPD6001

GEOMETRY

PROCESS DETAILS

BACKSIDE CATHODE

R1 (1-August 2002)

Process

EPITAXIAL PLANAR

Die Size

11 x 11 MILS

Die Thickness

11 MILS

Anode Bonding Pad Area

3.3 x 3.3 MILS

Top Side Metalization

Al - 15,000Å

Back Side Metalization

Au - 18,000Å

145 Adams Avenue

Hauppauge, NY 11788 USA

Tel: (631) 435-1110

Fax: (631) 435-1824

www.centralsemi.com

GROSS DIE PER 4 INCH WAFER

94,130

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