AP64202

Document number: DS43574 Rev. 1 - 2

18 of 21

www.diodes.com

March 2021

© Diodes Incorporated

AP64202

Layout

PCB Layout

1.

The AP64202 works at 2A load current so heat dissipation is a major concern in the layout of the PCB. 2oz copper for both the top and

bottom layers is recommended.

2.

Place the input capacitors as closely across VIN and GND as possible.

3.

Place the inductor as close to SW as possible.

4.

Place the output capacitors as close to GND as possible.

5.

Place the feedback components as close to FB as possible.

6.

If using four or more layers, use at least the 2nd and 3rd layers as GND to maximize thermal performance.

7.

Add as many vias as possible around both the GND pin and under the GND plane for heat dissipation to all the GND layers.

8.

Add as many vias as possible around both the VIN pin and under the VIN plane for heat dissipation to all the VIN layers.

9.

See Figure 28 for more details.

C2

EXPOSED PAD

BST

VIN

EN

RT/CLK

FB

SS

GND

SW

C3

R1

R2

RT

VIN

VOUT

GND

SW

Figure 28. Recommended PCB Layout