6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

Parameter

DEVICE

MIN

MAX

UNIT

PPP

IEC 61000-4-5 Power (tp – 8/20 µs) at 25°C

ESD2CANFD24

133

W

IPP

IEC 61000-4-5 current (tp – 8/20 µs) at 25°C

3.5

A

TA

Operating free-air temperature

-55

150

°C

TJ

Junction temperature

-55

150

Tstg

Storage temperature

-65

155

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

6.2 ESD Ratings—JEDEC Specification

PARAMETER

TEST CONDITION

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)

± 2500

V

Charged device model (CDM), per JEDEC specification JS-002 (2)

± 1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufactuuring with a standard ESD control proccess.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufactuuring with a standard ESD control proccess.

6.3 ESD Ratings—IEC Specification

over TA = 25°C (unless otherwise noted)

Parameter

Test Conditions

DEVICE

VALUE

UNIT

V(ESD)

Electrostatic discharge

IEC 61000-4-2 Contact Discharge, all pins

ESD2CANFD24

±25000

V

IEC 61000-4-2 Air-gap Discharge, all pins

±25000

6.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

Parameter

MIN

NOM

MAX

UNIT

VIN

Input voltage

-24

24

V

TA

Operating free-air temperature

-55

150

°C

6.5 Thermal Information

THERMAL METRIC(1)

ESD2CANFD24

UNIT

DBZ (SOT-23)

3 PINS

RθJA

Junction-to-ambient thermal resistance

316.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

170.7

°C/W

RθJB

Junction-to-board thermal resistance

156.2

°C/W

ΨJT

Junction-to-top characterization parameter

45.9

°C/W

ΨJB

Junction-to-board characterization parameter

155.1

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

ESD2CANFD24

SLVSH12 – NOVEMBER 2022

www.ti.com

4

Submit Document Feedback

Copyright © 2022 Texas Instruments Incorporated

Product Folder Links: ESD2CANFD24