AP3108LS

Document number: DS42105 Rev. 3 - 2

15 of 16

www.diodes.com

February 2021

© Diodes Incorporated

AP3108LS

Package Outline Dimensions

Please see http://www.diodes.com/package-outlines.html for the latest version.

(1)

Package Type: SSOP-9 (Type CJ)

Suggested Pad Layout

Please see http://www.diodes.com/package-outlines.html for the latest version.

(1)

Package Type: SSOP-9 (Type CJ)

Mechanical Data



Moisture Sensitivity: MSL Level 1 per J-STD-020



Terminals: Finish

– Matte Tin Plated Leads, Solderable per JESD22-B102



Weight: 0.08 grams (Approximate)

b

e

E

A

D

A1

c

0

A2

L

E1

X

C

Y1

G

Y

SSOP-9 (Type CJ)

Dim

Min

Max

Typ

A

1.35

1.75

--

A1

0.10

0.25

--

A2

1.350

1.550

--

b

0.270

0.430

--

c

0.170

0.258

--

D

4.70

5.10

--

E

5.80

6.20

--

E1

3.80

4.00

--

e

--

--

1.00

L

0.40

1.27

--

θ

0



8



--

All Dimensions in mm

Dimensions Value (in mm)

C

1.00

G

3.40

X

0.60

Y

2.00

Y1

7.40