PTCTZ

www.vishay.com

Vishay BCcomponents

Revision: 27-Nov-15

2

Document Number: 29068

For technical questions, contact: nlr@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

PTC OUTLINES

DIMENSIONS in millimeters

DIMENSIONS OF SOLDER LANDS in millimeters

SOLDERING CONDITIONS

This SMD thermistor is only suitable for reflow soldering, in accordance with JEDEC J-STD-020D. Soldering processes

which can be used are reflow (infrared and convection heating) and vapor phase. The maximum temperature of 260 °C during

10 s should not be exceeded and no liquid flux should be allowed to reach the ceramic body.

Typical examples of a soldering processes that will provide reliable joints without damage, are shown below.

MOUNTING CONDITIONS

A flat pick-up area of minimum 10 mm2 and low weight allows for fast placement.

Because of the nature of PTC ceramic material the component should not be touched with bare hands, as the residue

of perspiration can influence component behavior at high temperatures.

Handling forces applied to the component should be limited to 5 N in any condition.

PTC SMD ceramic size: 6.5 mm

3.6 ± 0.1

10 ± 0.25

8.0

2.8

2

4 ± 0.1

4 ± 0.2

0.2

10°

max.

1

7.6 ± 0.25

3.45

± 0.15

1.2

7.3

0

- 0.2

0.6

+ 0.6

0

3

2

2

3

1

11

5

2

PACKAGING

TYPE

QUANTITY

CARRIER TAPE

WIDTH

PITCH

REEL DIAMETER

PTCTZ

1500

PS conductive blister tape acc. IEC60286-3

16 mm

12 mm

330 mm

MATERIAL INFORMATION

REF.

DESCRIPTION

MATERIAL AND REMARKS

1

Ceramic

BaTiO3 doped

2

Metalization

NiCr Ag layer (vacuum deposition)

3

Lead frame

Ni plated phosphor bronze material covered by matte tin layer

0

50

100

150

200

250

300

250

200

150

100

50

0

t (s)

215 °C

180 °C

20 s to 40 s

Internal preheating,

e.g. by infrared,

max. 2 K/s

100 °C

130 °C

External

preheating

Forced

cooling

T

(°C)

Typical values (solid line)

Process limits (dotted lines)

Vapor phase soldering

Reflow soldering

0

50

100

150

200

250

300

250

200

150

100

50

0

10 s

260 °C

t (s)

215 °C

180 °C

10 s

40 s

2 K/s

T

(°C)

245 °C

130 °C

Typical values (solid line)

Process limits (dotted lines)