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DF2S6M4FS датащи(PDF) 5 Page - Toshiba Semiconductor

номер детали DF2S6M4FS
подробное описание детали  ESD Protection Diodes Silicon Epitaxial Planar
PDF  9 Pages
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производитель  TOSHIBA [Toshiba Semiconductor]
домашняя страница  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

DF2S6M4FS датащи(HTML) 5 Page - Toshiba Semiconductor

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DF2S6M4FS
5
8.
8.
8.
8. Electrical Characteristics (Unless otherwise specified, T
Electrical Characteristics (Unless otherwise specified, T
Electrical Characteristics (Unless otherwise specified, T
Electrical Characteristics (Unless otherwise specified, Taaaa = 25
= 25
= 25
= 25 
))))
VRWM: Working peak reverse voltage
VBR: Reverse breakdown voltage
IBR: Reverse breakdown current
IR: Reverse current
VC: Clamp voltage
IPP: Peak pulse current
RDYN: Dynamic resistance
IF: Forward current
VF: Forward voltage
Fig.
Fig.
Fig.
Fig. 8.1
8.1
8.1
8.1 Definitions of Electrical Characteristics
Definitions of Electrical Characteristics
Definitions of Electrical Characteristics
Definitions of Electrical Characteristics
Characteristics
Working peak reverse voltage
Total capacitance
Dynamic resistance
Reverse breakdown voltage
Reverse current
Clamp voltage
Symbol
VRWM
Ct
RDYN
VBR
IR
VC
Note
(Note 1)
(Note 2)
(Note 3)
(Note 2)
Test Condition
VR = 0 V, f = 1 MHz
IBR = 1 mA
VRWM = 5.5 V
IPP = 1 A
IPP = 2 A
ITLP = 16 A
ITLP = 30 A
Min
5.6
Typ.
0.45
0.35
6.3
7.5
9
13.5
23
Max
5.5
0.55
7.9
0.1
15
Unit
V
pF
Ω
V
µA
V
V
Note 1: Recommended operating condition.
Note 2: TLP parameters: Z0 = 50 Ω, tp = 100 ns, tr = 300 ps, averaging window: t1 = 30 ns to t2 = 60 ns, extraction of
dynamic resistance using least squares fit of TLP characteristics between IPP1 = 8 A and IPP2 = 16 A.
Note 3: Based on IEC61000-4-5 8/20 µs pulse.
2019-11-01
Rev.2.0
©2019
Toshiba Electronic Devices & Storage Corporation



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