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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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STM32L062K8 датащи(PDF) 86 Page - STMicroelectronics |
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STM32L062K8 датащи(HTML) 86 Page - STMicroelectronics |
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86 / 124 page  Electrical characteristics STM32L062x8 86/124 DS10183 Rev 11 Figure 24. Typical connection diagram using the ADC 1. Refer to Table 55: ADC characteristics for the values of RAIN, RADC and CADC. 2. Cparasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the pad capacitance (roughly 7 pF). A high Cparasitic value will downgrade conversion accuracy. To remedy this, fADC should be reduced. General PCB design guidelines Power supply decoupling should be performed as shown in Figure 25 or Figure 26, depending on whether VREF+ is connected to VDDA or not. The 10 nF capacitors should be ceramic (good quality). They should be placed as close as possible to the chip. Figure 25. Power supply and reference decoupling (VREF+ not connected to VDDA) MSv34712V1 VDDA AINx IL±50nA VT RAIN(1) Cparasitic VAIN VT RADC 12-bit converter CADC Sample and hold ADC converter MS41913V1 VREF+ STM32Lxx VDDA VSSA 1 μF // 100 nF 1 μF // 100 nF |
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