CLL3H0914L-700_0914LS-700

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© Ampleon Netherlands B.V. 2022. All rights reserved.

Product data sheet

Rev. 1 — 15 July 2022

4 of 18

CLL3H0914L(S)-700

L-band internally pre-matched GaN-SiC HEMT

7.

Application information

7.1 Circuit information

Printed-Circuit Board (PCB): Rogers 4350B;



metallization; thickness copper plating = 70

m; 1200 MHz to 1400 MHz demo board.

See Table 8 for list of components.

Fig 1.

Component layout for demo board

Table 8.

List of components

For test circuit see Figure 1.

Component

Description

Value

Remarks

C1, C2

multilayer ceramic chip capacitor 9.1 pF

ATC 100A

C3, C4

multilayer ceramic chip capacitor 5.1 pF

ATC 100A

C5, C6, C7, C8,

C9, C10, C16

multilayer ceramic chip capacitor 100 pF

ATC 100A

C11

multilayer ceramic chip capacitor 4.7

F, 100 V Murata:

GRM42256X7S475K100H530

C12

electrolytic capacitor

470

F, 63 V

C13, C14

multilayer ceramic chip capacitor 1.2 pF

ATC 100A

C15

multilayer ceramic chip capacitor 24 pF

ATC 100A

C17, C18

multilayer ceramic chip capacitor 72 pF

ATC 100A

C19, C20

multilayer ceramic chip capacitor 10 nF, 50 V

Murata: C1206C104K1RAC

C21, C22

multilayer ceramic chip capacitor 4.7

FTDK

R1

shunt resistor

10 m

, 5 W

R2, R3

resistor

8.2



SMD 1206

R4, R5

resistor

4.7



SMD 1206

R6

shunt resistor

82



SMD 0603

C10

C5

C7

C8

C11

C12

C4

C3

C6

C2

R1

C1

C9

C19

C18

R4

C22 R5

R3 R2

C21

C20

C17

C15

C14

C13

R6

C16

amp01164

40 mm

60 mm

40 mm