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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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LT8686SJVPBF датащи(PDF) 21 Page - Analog Devices |
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LT8686SJVPBF датащи(HTML) 21 Page - Analog Devices |
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21 / 26 page  LT8686S 21 Rev. 0 For more information www.analog.com either direct load current reduction or reducing the duty cycle or duration over which the maximum load current occurs. Die junction temperature can also be reduced by lowering the ambient temperature or the addition of air flow. Figure 5 shows the approximate allowable on chip power dissipation for a given ambient temperature using a θJA = 20°C/W. The LT8686S contains an internal thermal shutdown fea- ture that will stop switching if the die temperature rises to approximately 177°C. Switching will resume when the temperature falls approximately 5°C. This feature is not production tested and is intended as a failsafe only. APPLICATIONS INFORMATION θJA = 20 °C/W AMBIENT TEMPERATURE TA (°C) 50 75 100 125 150 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 8686S F05 Figure 5. Maximum Loss vs Ambient Temperature |
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