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DFE201610E-R33M датащи(PDF) 25 Page - Kinetic Technologies. |
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DFE201610E-R33M датащи(HTML) 25 Page - Kinetic Technologies. |
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25 / 25 page ![]() KTB8331 December 2021 – Revision 04b Page 25 of 25 Kinetic Confidential Packaging Information WLCSP35-15 (1.340mm x 2.045mm x 0.620mm) 4x 0.400mm 2x 0.400mm 15x 0.27mm Ø ±0.027mm 1.340mm ±0.050mm 2.045mm ±0.050mm 0.215mm ±0.022mm 0.620mm ±0.045mm 0.025mm ±0.003mm Bottom View Side View Top View Top Side Die Coating A1 Corner Recommended Footprint 1.60mm 0.80mm 0.22mm Copper Pad Diameter 0.40mm 0.40mm (NSMD Pad Type) 0.32mm Solder Mask Opening Kinetic Technologies cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Kinetic Technologies product. No intellectual property or circuit patent licenses are implied. Kinetic Technologies reserves the right to change the circuitry and specifications without notice at any time. |
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