DGD0280

Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Value

Unit

Low-Side Fixed Supply Voltage

VCC

-0.3 to +22

V

Output Voltage (OUT)

VOUT

-0.3 to VCC+0.3

V

Logic Input Voltage (IN)

VIN

-5 to VCC+0.3

V

Thermal Characteristics (@TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Value

Unit

Power Dissipation Linear Derating Factor (Note 5)

PD

0.89

W

Thermal Resistance, Junction to Ambient (Note 5)

RϴJA

117

°C/W

Thermal Resistance, Junction to Case (Note 5)

RϴJC

12.5

°C/W

Operating Temperature

TJ

+150

°C

Lead Temperature (Soldering, 10s)

TL

+300

Storage Temperature Range

TSTG

-55 to +150

Note:

5. When mounted on a standard JEDEC 2-layer FR-4 board with minimum recommended pad layout.

ESD Ratings (Note 6)

Characteristic

Symbol

Value

Unit

JEDEC Class

Electrostatic Discharge – Human Body Model

ESD HBM

2000

V

2

Electrostatic Discharge – Charged Device Model

ESD CDM

1000

V

IV

Note:

6. Refer to JEDEC specification JESD22-A114 and JESD22-C101.

Recommended Operating Conditions

Parameter

Symbol

Min

Max

Unit

Supply Voltage

VCC

4.5

18

V

Output Voltage (OUT)

VOUT

0

VCC

V

Logic Input Voltage (IN)

VIN

0

5

V

Ambient Temperature

TA

-40

+125

°C

DGD0280

Document number: DS41282 Rev. 2 - 2

3 of 11

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September 2019

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