Aluminum Electrolytic Capacitors (Radial lead Type)

2.2 Capacitor insertion

(1) Verify the correct capacitance and rated voltage of the capacitor.

(2) Verify the correct polarity of the capacitor before insertion.

(3) Verify the correct terminal dimension and land pattern size for surface mount type, or holes’ pitch for radial

lead type before mount to avoid short circuit, stress on the terminals, and/or lack of terminal strength.

(4) Excessive mounting pressure can cause high leakage current, short circuit, or disconnection.

(5) When using a mounter for radial lead type, avoid cutter wear and acute angle of lead-bending with respect to

circuit board. That may create excessive stress and pull the lead to damage the capacitor.

2.3 Reflow soldering (for surface mount type)

(1) Surface-mount type capacitor are exclusively for reflow soldering.

　When reflow solder is used an ambient heat condition system such as the simultaneous use of infrared

　and hot-air is recommended.

(2) Observe proper soldering conditions (temperature, time, etc.). Do not exceed the specified limits.

If the peak temperature is high or if the heating time is long, it may cause deterioration of the electrical

characteristics and life characteristics.

Recommended soldering condition is a guideline for ensuring the basic characteristics of the components,

but not for the stable soldering conditions. Conditions for proper soldering should be set up according to

individual onditions.

　・ The Temperature on Capacitor top shall be measured by using thermal couple that is fixed firmly by

epoxy glue.

(3) In case of use in 2 times reflow, 2nd reflow must be done when the capacitor’s temperature return back

　to normal level.

(4) In our recommended reflow condition , the case discoloration and the case swelling might be slightly

　generated. But please acknowledge that these two phenomena do not influence the reliability of the product.

(5) The crack on top marking might be occurred by reflow heat stress.

　But please acknowledge that it does not influence the reliability of the product.

(6) VPS (Vapor Phase Soldering) reflow can cause significant characteristics change and/ or mounting failure

　due to deformation by acute temperature rise.

　VPS is acceptable provided that the process does not exceed recommended reflow profile and

　temperature rise is less than 3 ℃/sec.

　Please contact Panasonic for detailed conditions.

(7) The vibration-proof capacitors of size ø6.3 has support terminals extending from the bottom side to the lead edge.

Then, make sure to find appropriate soldering conditions to form fillet on the support terminals if required for

appearance inspection. However, even if sufficient solder fillets are not observed, the reliability of

vibration-proof will not be lowered because the support terminals on the bottom side enhance the solder

joint to PCB.

2.4 Flow soldering

(1) Radial lead type capacitors cannot apply to reflow soldering.

(2) Do not immerse the capacitor body into the solder bath as excessive internal pressure could result.

(3) Apply proper soldering conditions (temperature, time, etc.). Do not exceed the specified limits.

(4) Do not allow other parts or components to touch the capacitor during soldering.

2.5 Manual soldering

(1) Apply soldering conditions (temperature and time) based on the specification, or do not exceed temperature

of 350 ℃ for 3 seconds.

(2) If a soldered capacitor must be removed and reinserted, avoid excessive stress on the capacitor leads.

(3) Avoid physical contacts between the tip of the soldering iron and capacitors to prevent or capacitor failure.

(4) When bending lead wires of radial type capacitors to match the hole pitch on PCB, avoid applying excessive

stress to the capacitor body.

2.6 Other soldering considerations

Rapid temperature rise during the preheat operation and resin bonding operation can cause cracking of the

capacitor’s vinyl sleeve. For heat curing, do not exceed 150 ℃ for the maximum time of 2 minutes.

2.7 Capacitor handling after soldering

(1) Avoid moving the capacitor after soldering to prevent excessive stress on the lead wires where they enter

the seal. The capacitor may break from element portion due to a torque at outer rim, causing a large stress

to terminals.

(2) Do not use the capacitor as a handle when moving the circuit board assembly. The total weight of the

board would apply to element portion through terminals, and the capacitor may break.

(3) Avoid striking the capacitor after assembly to prevent failure due to excessive shock. The capacitor may

break due to excessive shock or load above specified range.

01-Oct-21