1

3

2

4

5

6

7

Vcc1

Vtune

RF

Out

RF

Div1

RF

Div2

(Maximum

100pF)

Vcc2

Vcc3

1

3

2.000

(0.079)

0.297

(0.011)

2

0.495

(0.020)

0.000

0.000

1.631

(0.064)

4

1.229

(0.048)

5

0.732

(0.029)

1.389

(0.055)

2.000

(0.079)

6

0.991

(0.039)

7

Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099

Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

Characteristic Data and Specifications are subject to change without notice.

©

2005 Mimix Broadband, Inc.

Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept

their obligation to be compliant with U.S. Export Laws.

Page 3 of 5

Mechanical Drawing

Bias Arrangement

Bypass Capacitors - See App Note [2]

(Note: Engineering designator is 14OSC0501)

Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.

Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold

All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).

Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.

Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 2.480 mg.

Bond Pad #1 (RF Div2)

Bond Pad #2 (RF Div1)

Bond Pad #3 (RF Out)

Bond Pad #4 (Vcc1)

Bond Pad #5 (Vtune)

Bond Pad #6 (Vcc2)

Bond Pad #7 (Vcc3)

May 2005 - Rev 05-May-05

14.2-15.2 GHz GaAs MMIC

Voltage Controlled Oscillator

14OSC0501

14OSC0501

RF

Out

Vcc1

Vtune

Vcc2

Vcc3

RF

Div