FSV2050V

www.onsemi.com

2

THERMAL CHARACTERISTICS (TA = 25°C unless otherwise noted) (Note 1)

Symbol

Characteristic

Minimum Land

Pattern

Maximum Land

Pattern

Unit

RqJA

Junction−to−Ambient Thermal Resistance

100

40

°C/W

ΨJL

Junction−to−Lead Thermal Characteristics,

Thermocouple Soldered to Anode

15

12

°C/W

Junction−to−Lead Thermal Characteristics,

Thermocouple Soldered to Cathode

6

5

1. The thermal resistances (RqJA & ΨJL) are characterized with device mounted on the following FR4 printed circuit boards, as shown in Figure 1

and Figure 2. PCB size: 76.2 x 114.3 mm. Minimum land pattern size: 4.9 x 4.8 mm (big pattern, x1), 1.4 x 1.52 mm (small pattern, x2).

Maximum land pattern size: 30 x 30 mm (pattern, x2). Force line trace size = 55 mils, sense line trace size = 4 mils.

Figure 1. Minimum Land Pattern of 2 oz Copper

F

S

F

S

F

S

Figure 2. Maximum Land Pattern of 2 oz Copper

F

S

F

S

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

BVR

Breakdown Voltage

IR = 500 mA

50

55.3

−

V

VF

Forward Voltage Drop

IF = 20 A

−

485

550

mV

IR

Reverse Current

VR = 50 V

−

60.3

320

mA

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

ORDERING INFORMATION

Part Number

Top Mark

Package

Shipping†

FSV2050V

FSV2050V

TO−277−3LD

(Pb−Free/Halogen Free)

5000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.