FT232R USB UART I.C. Datasheet Version 1.04

© Future Technology Devices International Ltd. 2005

Page 15

5.5 Solder Reflow Profile

Critical Zone: when

T is in the range

T to T

Time, t (seconds)

25

P

T = 25º C to T

t

Preheat

S

Ramp Up

L

p

Ramp

Down

T Max

S

T Min

S

Figure 10 - FT232R Solder Reflow Profile

The recommended values for the solder reflow profile are detailed in Table 4. Values are shown for both a completely

Pb free solder process (i.e. the FT232R is used with Pb free solder), and for a non-Pb free solder process (i.e. the

FT232R is used with non-Pb free solder).

Table 4 - Reflow Profile Parameter Values

Profile Feature

Pb Free Solder Process

Non-Pb Free Solder Process

Average Ramp Up Rate (T

3°C / second Max.

3°C / Second Max.

Preheat

- Temperature Min (T

- Temperature Max (T

- Time (t

150°C

200°C

60 to 120 seconds

100°C

150°C

60 to 120 seconds

Time Maintained Above Critical Temperature T

- Temperature (T

- Time (t

217°C

60 to 150 seconds

183°C

60 to 150 seconds

Peak Temperature (T

260°C

240°C

Time within 5°C of actual Peak Temperature (t

20 to 40 seconds

20 to 40 seconds

Ramp Down Rate

6°C / second Max.

6°C / second Max.

Time for T= 25°C to Peak Temperature, T

p

8 minutes Max.

6 minutes Max.

The FT232R is supplied in Pb free 28 LD SSOP and QFN-32 packages. The recommended solder reflow profile for

both package options is shown in Figure 10.