Contents

1

Block diagram and pin description .................................................3

1.1

Block diagram ................................................................. 3

1.2

Pin description ................................................................. 4

2

Mechanical and electrical specifications ...........................................5

2.1

Mechanical characteristics ....................................................... 5

2.2

Electrical characteristics......................................................... 6

2.3

Temperature sensor characteristics ............................................... 6

2.4

Communication interface characteristics ........................................... 7

2.4.1

SPI - serial peripheral interface .............................................. 7

2.4.2

I²C - inter-IC control interface ............................................... 8

2.5

Absolute maximum ratings....................................................... 9

3

Package information..............................................................10

3.1

Soldering information .......................................................... 10

3.2

LGA-12 package information .................................................... 10

Revision history .......................................................................11

Contents ..............................................................................12

LIS2DU12

Contents

DB4522 - Rev 1

page 12/13