B722 datasheet(8/23 Pages) TDK

8 / 23 page

Test

Test methods/conditions

Requirement

Solderability

IEC 60068-2-20, test Ta,

method 1 with modified conditions for

lead-free solder alloys: 245

°C, 3 s:

After dipping the terminals to a depth of

approximately 3 mm from the body in a

soldering bath of 245

°C for 3 s, the

terminals shall be visually examined.

The inspection shall be

carried out under adequate

light with normal eyesight or

with the assistance of a

magnifier capable of giving

a magnification of 4 to

10 times. The dipped

surface shall be covered

with a smooth and bright

solder coating with no more

than small amounts of

scattered imperfections

such as pinholes or

un-wetted or de-wetted

areas. These imperfections

shall not be concentrated in

one area.

Resistance to soldering

heat

IEC 60068-2-20, test Tb, method 1A,

260

°C, 10 s:

Each lead shall be dipped into a solder

bath having a temperature of 260

±5 °C

to a point 2.0 to 2.5 mm from the body

of the specimen, be held there for

±1 s and then be stored at room

temperature and normal humidity for

1 to 2 h.

The change of VV shall be measured

and the specimen shall be visually

examined.

∆V/V (1 mA)| ≤5%

No visible damage

Tensile strength

IEC 60068-2-21, test Ua1

After gradually applying the force

specified below and keeping the unit

fixed for 10 s, the terminal shall be

visually examined for any damage.

Force for wire diameter:

0.6 mm = 10 N

0.8 mm = 10 N

1.0 mm = 20 N

∆V/V (1 mA)| ≤5%

No break of solder joint,

no wire break

Leaded varistors

B722*

SuperioR, S25 series

Page 8 of 23

Please read Cautions and warnings and

Important notes at the end of this document.

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