100V 0.3A Fast Switching Diode

- CD4148

Small-Signal high speed switching diode in bare die form



Fast Switching Speed

350 x 350

13.78 x 13.78

µm

Die Size (Unsawn)

mils

Anode Pad Size

110 Ø

2.8 Ø

µm

mils

Die Thickness

230 (±15)

9.05 (±0.59)



High conductance



General purpose switching applications



High reliability tested grades.

Rev 1.0

22/01/19

Features:

Die Dimensions in µm (mils)

110 (3)

ANODE

350 (14)



No suffix - MIL-STD-750 /2073 Visual Inspection



“H” - MIL-STD-750 /2073 Visual Inspection

+ MIL-PRF-38534 Class H LAT



“K” - MIL-STD-750 /2073 Visual Inspection

+ MIL-PRF-38534 Class K LAT

LAT = Lot Acceptance Test.

For further information on LAT process flows see below.

www.siliconsupplies.com\quality\bare-die-lot-qualification

Supply Formats:

Mechanical Specification



Default – Die in Waffle Pack (400 per tray capacity)



Sawn Wafer on Tape – By specific request

ANODE

CHIP BACKSIDE IS CATHODE

The following part suffixes apply:

Ordering Information



Unsawn Wafer – By specific request

µm

mils

Top Metal Composition

Al



Die Thickness <> 230µm(9 Mils) – On request



With additional electrical selection – On request

Back Metal Composition

AuAs

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