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AT24C01C датащи(PDF) 37 Page - Microchip Technology

номер детали AT24C01C
подробное описание детали  I²C-Compatible (Two-Wire) Serial EEPROM 1‑Kbit (128 x 8), 2‑Kbit (256 x 8)
PDF  45 Pages
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производитель  MICROCHIP [Microchip Technology]
домашняя страница  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

AT24C01C датащи(HTML) 37 Page - Microchip Technology

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RECOMMENDED LAND PATTERN
Dimension Limits
Units
Optional Center Pad Width
Optional Center Pad Length
Contact Pitch
Y2
X2
1.40
1.60
MILLIMETERS
0.50 BSC
MIN
E
MAX
Contact Pad Length (X8)
Contact Pad Width (X8)
Y1
X1
0.85
0.30
NOM
12
8
C
Contact Pad Spacing
2.90
Contact Pad to Center Pad (X8)
G1
0.20
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.30
1.00
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
© 2017 Microchip Technology Inc.
Microchip Technology Drawing C04-21355-Q4B Rev A
8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN]
Atmel Legacy YNZ Package
X2
Y2
Y1
SILK SCREEN
X1
E
C
EV
G2
G1
ØV
Contact Pad to Contact Pad (X6)
G2
0.33
AT24C01C/AT24C02C
Packaging Information
© 2018 Microchip Technology Inc.
Datasheet
DS20006111A-page 37



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