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RT8249 датащи(PDF) 17 Page - Richtek Technology Corporation

номер детали RT8249
подробное описание детали  Dual-Channel Synchronous DC/DC Step-Down Controller with 5V/3.3V LDOs
PDF  23 Pages
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производитель  RICHTEK [Richtek Technology Corporation]
домашняя страница  http://www.richtek.com
Logo RICHTEK - Richtek Technology Corporation

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RT8249A/B/C
17
DS8249A/B/C-02
June 2014
www.richtek.com
©
Copyright
2014 Richtek Technology Corporation. All rights reserved.
is a registered trademark of Richtek Technology Corporation.
IL
t
IPEAK
ILOAD
ILIMIT
Figure 2.
“Valley” Current Limit
The RT8249A/B/C uses the on resistance of the
synchronous rectifier as the current sense element and
supports temperature compensated MOSFET RDS(ON)
sensing. The RILIM resistor between the CSx pin and GND
sets the current limit threshold. The resistor RILIM is
connected to a current source from CSx which is 50
μA
(typ.) at room temperature. The current source has a
4700ppm/
°C temperature slope to compensate the
temperature dependency of the RDS(ON). When the voltage
drop across the sense resistor or low-side MOSFET
equals 1/8 the voltage across the RILIM resistor, positive
current limit will be activated. The high-side MOSFET will
not be turned on until the voltage drop across the MOSFET
falls below 1/8 the voltage across the RILIM resistor.
Choose a current limit resistor according to the following
equation :
VLIMIT = (RLIMIT x 50
μA) / 8 = ILIMIT x RDS(ON)
RLIMIT = (ILIMIT x RDS(ON)) x 8 / 50
μA
Current Limit Setting
The RT8249A/B/C has cycle-by-cycle current limit control
and the OCP function only operation at CCM, it is disabled
at DEM in order to reduce quiescent current. The current
limit circuit employs a unique
“valley” current sensing
algorithm. If the magnitude of the current sense signal at
PHASEx is above the current limit threshold, the PWM
is not allowed to initiate a new cycle (Figure 2). The actual
peak current is greater than the current limit threshold by
an amount equal to the inductor ripple current. Therefore,
the exact current limit characteristic and maximum load
capability are a function of the sense resistance, inductor
value, battery and output voltage.
Figure 3. Charge Pump Circuit Connected to VCLK
MOSFET Gate Driver (UGATEx, LGATEx)
The high-side driver is designed to drive high current, low
RDS(ON) N-MOSFET(s). When configured as a floating driver,
5V bias voltage is delivered from the LDO5 supply. The
average drive current is also calculated by the gate charge
at VGS = 5V times switching frequency. The instantaneous
drive current is supplied by the flying capacitor between
the BOOTx and PHASEx pins. A dead-time to prevent
VCLK
VOUT1
D1
D2
D3
C3
D4
C1
C2
C4
Charge Pump
Carefully observe the PC board layout guidelines to ensure
that noise and DC errors do not corrupt the current sense
signal at PHASEx and GND. Mount or place the IC close
to the low-side MOSFET.
VCLK for Charge Pump
A 260kHz VCLK signal can be used for the external charge
pump circuit. The VCLK signal becomes available when
EN1 enters ON state. VCLK driver circuit is driven by BYP1
voltage. In a design that does not require VCLK output,
tie 200
Ω between VCLK pin and GND so that VCLK is
turned off. The accuracy of VCLK disable resistor is
recommended less than 5%.
The external 14V charge pump is driven by VCLK. As
shown in Figure 3, when VCLK is low, C1 will be charged
by VOUT1 through D1. C1 voltage is equal to VOUT1 minus
the diode drop. When VCLK becomes high, C1 transfers
the charge to C2 through D2 and charges C2 voltage to
VVCLK plus C1 voltage. As VCLK transitions low on the
next cycle, C3 is charged to C2 voltage minus a diode
drop through D3. Finally, C3 charges C4 through D4 when
VCLK switches high. Thus, the total charge pump voltage,
VCP, is :
VCP = VOUT1
+ 2 x VVCLK − 4 x VD
where VVCLK is the peak voltage of the VCLK driver which
is equal to LDO5 and VD is the forward voltage dropped
across the Schottky diode.



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