AM9468

Document number: DS38663 Rev. 1 - 2

13 of 16

www.diodes.com

May 2016

© Diodes Incorporated

AM9468

Thermal Performance

TSSOP-16 Power Dissipation De-rating Curve 1 (Note 13)

-40

0

25

50

60

70

80

85

90

95

100

105

110

120

125

130

140

150

845

704

563

282

0

Note 13:

TSSOP-16 is soldered on FR-4 substrate 4-layer 1.6mm thickness PCB board, calculated in accordance with JESD 51-7.

TSSOP-16 Power Dissipation De-rating Curve 2 (Note 14)

-40

0

25

50

60

70

80

85

90

95

100

105

110

120

125

130

140

150

920

836

752

669

502

418

334

167

0

Note 14:

TSSOP-16 is soldered to the circular PCB diameter

1.2” with the center circular cutout diameter of 0.53”. The Hall element space cut-out is 0.12”x0.08”. 2-

layer 2oz.copper FR-4 PCB (1.6mm thickness) with partial copper flood on the bottom layer.

TSSOP-16 Thermal Derating Curve

TSSOP-16 Thermal Derating Curve