LM2771SD datasheet(4/10 Pages) NSC

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Electrical Characteristics (Notes 2, 8) (Continued)

Note 4: For detailed information on soldering requirements and recommendations, please refer to National Semiconductor’s Application Note 1187 (AN-1187):

Leadless Leadframe Package (LLP).

Note 5: The Human body model is a 100pF capacitor discharged through a 1.5k

Ω resistor into each pin. The machine model is a 200pF capacitor discharged

directly into each pin. MIL-STD-883 3015.7

Note 6: Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =110

oC), the maximum power

dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (θJA), as given by the

following equation: TA-MAX =TJ-MAX-OP –(θJA xPD-MAX).

Note 7: Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists,

special care must be paid to thermal dissipation issues.

Note 8: Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.

Note 9: CIN,COUT,C1: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics.

Note 10: VOUT is set to 1.6V during this test.

Note 11: Open loop output resistance can be used to predict output voltage when, under low VIN and high IOUT conditions, VOUT falls out of regulation. VOUT =VIN/2

−(ROL xIOUT)

Note 12: Maximum input current is equal to half the maximum output current for buck-mode switched capacitor converters.

Note 13: There is a 350k

Ω pull-down resistor connected internally between the EN pin and GND.

Block Diagram

20183803

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