ADP5589ACPZ-00-R7 datasheet(49/52 Pages) AD

49 / 52 page

Data Sheet

ADP5589

Rev. B | Page 49 of 52

OUTLINE DIMENSIONS

0.40

BSC

0.50

0.40

0.30

0.25

0.20

0.15

COMPLIANT

TO JEDEC STANDARDS MO-220-WFFE.

BOTTOM VIEW

TOP VIEW

EXPOSED

PAD

PIN 1

INDICATOR

3.60

3.50 SQ

3.40

SEATING

PLANE

0.80

0.75

0.70

0.05 MAX

0.02 NOM

0.203 REF

0.20 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

2.30

2.20 SQ

2.10

Figure 32. 24-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

3.5 mm × 3.5 mm Body, Very Very Thin Quad

(CP-24-11)

Dimensions shown in millimeters

0.560

0.500

0.440

SIDE VIEW

0.230

0.200

0.170

0.300

0.260

0.220

COPLANARITY

0.05

SEATING

PLANE

BOTTOM VIEW

(BALL SIDE UP)

TOP VIEW

(BALL SIDE DOWN)

BALL A1

IDENTIFIER

0.40

REF

1.60

REF

2.030

1.990 SQ

1.950

Figure 33. 25-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-25-5)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

ADP5589ACPZ-00-R7

−40°C to +85°C

24-Lead Lead Frame Chip Scale Package[LFCSP_WQ]

CP-24-11

ADP5589ACPZ-01-R7

−40°C to +85°C

24-Lead Lead Frame Chip Scale Package[LFCSP_WQ]

CP-24-11

ADP5589ACPZ-02-R7

−40°C to +85°C

24-Lead Lead Frame Chip Scale Package[LFCSP_WQ]

CP-24-11

ADP5589ACBZ-00-R7

−40°C to +85°C

25-Ball Wafer Level Chip Scale Package[WLCSP]

CB-25-5

ADP5589ACBZ-01-R7

−40°C to +85°C

25-Ball Wafer Level Chip Scale Package[WLCSP]

CB-25-5

ADP5589ACBZ-02-R7

−40°C to +85°C

25-Ball Wafer Level Chip Scale Package[WLCSP]

CB-25-5

ADP5589CP-EVALZ

Evaluation Board

1 Z = RoHS Compliant Part.

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