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SSM6P35AFE датащи(PDF) 3 Page - Toshiba Semiconductor

номер детали SSM6P35AFE
подробное описание детали  MOSFETs Silicon P-Channel MOS
PDF  8 Pages
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производитель  TOSHIBA [Toshiba Semiconductor]
домашняя страница  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

SSM6P35AFE датащи(HTML) 3 Page - Toshiba Semiconductor

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SSM6P35AFE
3
6. Electrical Characteristics
6.1. Static Characteristics
(Unless otherwise specified, Ta = 25 �)(Q1, Q2 Common)
Characteristics
Gate leakage current
Drain cut-off current
Drain-source breakdown voltage
Drain-source breakdown voltage
Gate threshold voltage
Drain-source on-resistance
Forward transfer admittance
(Note 1)
(Note 2)
(Note 3)
(Note 3)
Symbol
IGSS
IDSS
V(BR)DSS
V(BR)DSX
Vth
RDS(ON)
|Yfs|
Test Condition
VDS = 0 V, VGS = ±10 V
VDS = -20 V, VGS = 0 V
ID = -1 mA, VGS = 0 V
ID = -1 mA, VGS = 10 V
VDS = -10 V, ID = -100 µA
ID = -10 mA, VGS = -1.2 V
ID = -20 mA, VGS = -1.5 V
ID = -50 mA, VGS = -1.8 V
ID = -150 mA, VGS = -2.5 V
ID = -150 mA, VGS = -4.5 V
VDS = -10 V, ID = -100 mA
Min
�
�
-20
-10
-0.3
�
�
�
�
�
�
Typ.
�
�
�
�
�
3.2
2.3
2.0
1.5
1.1
430
Max
±1
-1
�
�
-1
20
4.0
2.9
2.1
1.4
�
Unit
µA
V
Ω
mS
Note 1: If a reverse bias is applied between gate and source, this device enters V(BR)DSX mode. Note that the drain-
source breakdown voltage is lowered in this mode.
Note 2: Let Vth be the voltage applied between gate and source that causes the drain current (ID) to below (-100 µA
for this device). Then, for normal switching operation, VGS(ON) must be higher than Vth, and VGS(OFF) must be
lower than Vth. This relationship can be expressed as: VGS(OFF) < Vth < VGS(ON).
Take this into consideration when using the device.
Note 3: Pulse measurement.
6.2. Dynamic Characteristics
(Unless otherwise specified, Ta = 25 �)(Q1, Q2 Common)
Characteristics
Input capacitance
Reverse transfer capacitance
Output capacitance
Switching time (rise time)
Switching time (turn-on delay time)
Switching time (fall time)
Switching time (turn-off delay time)
Symbol
Ciss
Crss
Coss
tr
td(on)
tf
td(off)
Test Condition
VDS = -10 V, VGS = 0 V,
f = 1 MHz
VDD = -10 V, ID = -50 mA,
VGS = 0 to -4.5 V, RG = 10 Ω
Duty ≤ 1%, VIN: tr, tf < 5 ns,
Common source, See Chapter 6.3.
Min
�
�
�
�
�
�
�
Typ.
21
2
6
42
17
145
420
Max
42
�
�
�
�
�
�
Unit
pF
ns
6.3. Switching Time Test Circuit
Fig. 6.3.1
Switching Time Test Circuit
Fig. 6.3.2
Input Waveform/Output Waveform
2021-02-01
Rev.3.0
©2017-2021
Toshiba Electronic Devices & Storage Corporation



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