SPF1

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Vishay Electro-Films

Revision: 18-Feb-2021

2

Document Number: 61105

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

RESISTOR MATERIAL

Typical reasons for using NiCr resistor material are for long term stability and high sheet rho. Typical recommended uses for

TaN are for non-hermetic applications where self-passivation is important.

RESISTOR MATERIAL

RESISTOR CODE

RESISTOR MATERIAL

SHEET RHO

(

Ω/SQ)

± 20 %

TCR

(ppm/°C)

TYPICAL VALUES

ANiCr

25

± 50

B

NiCr

50

± 100

C

NiCr

100

± 200

D

NiCr

200

± 250

1

TaN

25

± 50

2

TaN

50

± 100

3

TaN

75

± 250

METAL STACK

METAL

CODE

METAL STACK

TYPICAL

APPLICATION

TYPICAL

ATTACHMENT

METHOD

1

TiW (500 Å to 1000 Å) / Au (50 μ" min.)

Au and Al wirebondable

Epoxy

2

TiW (500 Å to 1000 Å) / Au (100 μ" min.)

Au and Al wirebondable

Epoxy

3

TiW (500 Å to 1000 Å) / Au (15 μ" to 40 μ") / Ni (20 μ" to 80 μ") / Au (50 μ" min.)

Au and Al wirebondable

and solderable

Epoxy or solder

4

TiW (500 Å to 1000 Å) / Au (15 μ" to 40 μ") / Ni (20 μ" to 80 μ") / Au (100 μ" min.)

Au and Al wirebondable

and solderable

Epoxy or solder

5

TiW (500 Å to 1000 Å) / Pd (1500 Å to 2500 Å) / Au (50 μ" min.)

Au and Al wirebondable

and solderable

Epoxy or solder

6

TiW (500 Å to 1000 Å) / Pd (1500 Å to 2500 Å) / Au (100 μ" min.)

Au and Al wirebondable

and solderable

Epoxy or solder

7

Cr (500 Å to 1500 Å) / Cu (5000 Å to 7000 Å) / Au (100 μ" min.)

Au and Al wirebondable

Epoxy

8

Cr (500 Å to 1500 Å) / Cu (500 u" min.) / Ni (20 μ" to 80 μ") / Au (100 μ" min.)

Au and Al wirebondable

and solderable.

High power applications

for low metal resistivity

Epoxy or solder